Tsinghua Unigroup: Relying on “hard core strength” to create today’s brilliance
From August 14th to 16th, 2020, the 8th China Electronic Information Expo (CITE2020) will be held in Shenzhen Convention and Exhibition Center. Through several professional exhibition areas such as CITE Theme Pavilion, New Display Pavilion, Intelligent Manufacturing and 3D Printing Pavilion, Artificial Intelligence Pavilion, 5G and Internet of Things Pavilion, this exhibition fully showcases the latest development achievements and trends of the electronic information industry in the intelligent era for the industry. An international first-class display platform in the field of electronic information, CITE2020 will unite well-known enterprises in related fields at home and abroad to display the latest development achievements.
As a large-scale comprehensive integrated circuit leader in China and a leading cloud network equipment and service provider for the entire industry chain, Tsinghua Unigroup has confirmed its participation in CITE2020. Tsinghua Unigroup now owns leading international and domestic chip and related components design and manufacturing enterprises, such as Tsinghua Unigroup, Tsinghua Unigroup, Linxens, Yangtze Memory, Wuhan Xinxin, Xi’an Tsinghua Guoxin, etc. The products cover mobile communication chips, Memory chips, FPGAs, AI chips, high-end router chips, micro connectors, and security chips. Tsinghua Unigroup integrated the resources of H3C Group, Tsinghua Unigroup, Tsinghua Unigroup, and Tsinghua Unigroup, and established the “Tsinghua Unigroup and Smart Business Group”. It faces the market with the brand-new “Tsinghua Unigroup” brand and strives to develop “Cloud + Intelligence”. “business.
In this exhibition, Tsinghua Unigroup participated in the exhibition with the theme of “enabling new infrastructure from core to cloud”, which perfectly fits the 5G + Internet of Things spirit of “mass entrepreneurship, innovation” and “Internet +” in this exhibition. A variety of high-quality products will be exhibited, and the following will focus on 2 of them.
1) YMTC 128-layer QLC 3D flash memory
As the industry’s first 3D NAND flash memory with 128-layer QLC specification, YMTC X2-6070 has the highest storage density per unit area, the highest I/O transmission speed and the highest single NAND flash memory chip capacity among the known models in the industry. In terms of I/O read and write performance, both X2-6070 and X2-9060 can achieve a data transfer rate of 1.6Gbps (Gigabits/s gigabits/second) under 1.2V Vccq voltage, the highest in the industry. QLC is a new technical form of 3D NAND after TLC (3 bit/cell). It has the characteristics of large capacity and high density, and is suitable for read-intensive applications. Each X2-6070 QLC flash memory chip has a 128-layer three-dimensional stack, a total of more than 366.5 billion effective charge-trapping (Charge-Trap) memory cells, each memory cell can store 4 bits of data, providing a total of 1.33 Tb of storage capacity. If the 0 or 1 of the recorded data is compared to the little “people” in the digital world, a 128-layer QLC chip of YMTC is equivalent to providing 366.5 billion rooms, each room can accommodate 4 “people”, which can accommodate a total of about 1.466 billion ” “people”, which is 5.33 times the capacity of the previous generation 64-layer single chip.
2) New H3C semiconductor‘s high-end router chip EasyCore
The commercial chip of this core network processor will be tape-out and put into production within this year, and can be widely used in routers and other network products. It is expected that H3C will release high-end router products using self-developed core network processors in the first half of next year. Innovative breakthroughs in the field of network communication chips will help H3C maintain its leadership in the competition in China’s high-end router market and have the ability to expand globally. The chip is manufactured using the 16nm process and has successfully entered the testing phase. After completing the verification of core IP such as CPU core, high-speed SerDes, 400G Ethernet and high-speed Interlaken, the first commercial network processor chip will be taped out within this year. It is expected to launch high-end router products equipped with self-developed core network processor chips in the first half of 2021.
Although the chip is small, it is not easy to develop.
Ziguang Zhanrui, a subsidiary of Ziguang, is the world’s third largest mobile chip design company for the open market, the world’s leading 5G communication chip company and the largest pan-connection chip supplier in China. Its products cover 2G/3G/4G/5G mobile communication baseband chips, AIoT chips, RF front-end chips, wireless connection chips, TV chips, etc., are one of the few companies in the world that fully master 2G/3G/4G/5G mobile communication technologies and IoT and other full-scene communication technologies.
Tsinghua Unigroup, a subsidiary of Tsinghua Unigroup, takes smart chips as the core, focuses on five core businesses of digital security, smart computing, high-reliability chips, high-end chip components, power and power management, and is deeply involved in smart interconnection, smart industry, smart finance, smart city, and smart life. , Six vertical areas of smart transportation, empowering “chips + hundreds of industries”. It has the first dual-interface smart card security chip in China that has passed the international SOGIS mutual recognition CC EAL 6+ security certification, the world’s highest security level certification, and its chips are widely used in bank cards, social security cards, residents’ health cards, transportation cards, residence permits , smart home, Internet of Things and other fields.
Tsinghua Unigroup’s Linxens is the world’s leading supplier of chip carrier tapes. The Linxens China factory, which is being invested and established in Tianjin, will reach the world’s most advanced level in terms of technical level and production process.
Wuhan Xinxin, a subsidiary of Tsinghua Unigroup, is a leading integrated circuit R&D and manufacturing enterprise, focusing on NOR Flash and wafer-level 3D integration technology. It is one of the leading NOR Flash wafer manufacturers in China and even the world.
Memory is one of the strategic priorities of Tsinghua Unigroup’s chip business. It has now begun to invest in the establishment of memory chip production bases in Wuhan, Nanjing, Chengdu, Chongqing and other places. Following the small-scale mass production of 32-layer 3D flash memory in 2018, its subsidiary Yangtze Memory, its 64-layer 3D flash memory using the Xtacking® architecture, announced the start of mass production in September 2019, and announced in January 2020 that more communications, system integration Computer customers, providing complete solution products such as embedded storage and solid-state drives.
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